| 发明名称 |
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE |
| 摘要 |
According to one embodiment, an electronic device includes a first element provided on a semiconductor substrate and used for actual operation, and a second element unit constituted by at least one second element for evaluation provided on the semiconductor substrate, wherein the first element includes a first plate-like portion and a first thin-film portion covering the first plate-like portion and forming a cavity therein, and the second element unit includes a plurality of second plate-like portions having different lengths, and at least one second thin-film portion covering the second plate-like portions and forming a cavity therein. |
| 申请公布号 |
US2017077215(A1) |
申请公布日期 |
2017.03.16 |
| 申请号 |
US201615068495 |
申请日期 |
2016.03.11 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
YAMAGUCHI Hitomi |
| 分类号 |
H01L49/02;H01G5/011 |
主分类号 |
H01L49/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
a first element provided on a semiconductor substrate and used for actual operation; and a second element unit constituted by at least one second element for evaluation provided on the semiconductor substrate, wherein the first element includes a first plate-like portion and a first thin-film portion covering the first plate-like portion and forming a cavity therein, and the second element unit includes a plurality of second plate-like portions having different lengths, and at least one second thin-film portion covering the second plate-like portions and forming a cavity therein. |
| 地址 |
Tokyo JP |
