| 发明名称 |
PACKAGING METHOD, DISPLAY PANEL, DISPLAY DEVICE AND PACKAGING APPARATUS |
| 摘要 |
A packaging method comprising forming a frit on a first substrate, affixing a second substrate to the first substrate in position, and irradiating the frit by laser beam so as to melt the frit. The packaging method further comprises performing an ultrasonic treatment on the frit by means of ultrasonic wave when the frit being melted. A display panel packaged by the packaging method and a display device having the display panel are disclosed. Further, a packaging device for performing the packaging method is also disclosed. |
| 申请公布号 |
US2017077443(A1) |
申请公布日期 |
2017.03.16 |
| 申请号 |
US201615137360 |
申请日期 |
2016.04.25 |
| 申请人 |
BOE TECHNOLOGY GROUP CO., LTD. ;ORDOS YUANSHENG OPTOELECTRONICS CO., LTD. |
发明人 |
JIANG Zhiliang |
| 分类号 |
H01L51/52;H01L51/56 |
主分类号 |
H01L51/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A packaging method comprising:
forming a frit on a first substrate; affixing a second substrate to the first substrate in position; and irradiating the frit by laser beam so as to melt the frit; wherein the method further comprises performing an ultrasonic treatment on the frit by means of ultrasonic wave when the frit being melted. |
| 地址 |
Beijing CN |
