发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR UNIT AND THE SEMICONDUCTOR UNIT |
摘要 |
In a solid-state imaging device including a plurality of pixels each pixel including a plurality of photodiodes, it is prevented that an incidence angle of incident light on the solid-state imaging device becomes large in a pixel in an end of the solid-state imaging device, causing a difference in output between the two photodiodes in the pixel, and thus autofocus detection accuracy is deteriorated. Photodiodes extending in a longitudinal direction of a pixel allay section are provided in each pixel. The photodiodes in the pixel are arranged in a direction orthogonal to the longitudinal direction of the pixel allay section. |
申请公布号 |
US2017077165(A1) |
申请公布日期 |
2017.03.16 |
申请号 |
US201615201485 |
申请日期 |
2016.07.03 |
申请人 |
Renesas Electronics Corporation |
发明人 |
KIMURA Masatoshi |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor unit including a solid-state imaging device including a plurality of pixels each including two photodiodes, the semiconductor unit comprising:
a semiconductor substrate; a pixel array section extending in a first direction along a main surface of the semiconductor substrate over the main surface of the semiconductor substrate; the pixels provided in the pixel array section; and the two photodiodes provided in the main surface of the semiconductor substrate in each of the pixels, wherein the two photodiodes are arranged in a second direction orthogonal to the first direction in the pixel. |
地址 |
Tokyo JP |