发明名称 RESIST PATTERN-FORMING METHOD
摘要 A resist pattern-forming method comprises applying a chemically amplified resist material on a substrate to form a resist film on the substrate. The resist film is patternwise exposed to a radioactive ray having a wavelength of no greater than 250 nm. The resist film patternwise exposed is floodwise exposed to a radioactive ray having a wavelength of greater than 250 nm. The resist film floodwise exposed is baked and developed with a developer solution comprising an organic solvent. The chemically amplified resist material comprises a component that is capable of generating a radiation-sensitive sensitizer and an acid upon an exposure. The component comprises: a radiation-sensitive sensitizer generating agent, and at least one of a radiation-sensitive acid-and-sensitizer generating agent and a radiation-sensitive acid generating agent. The radiation-sensitive sensitizer generating agent comprises a compound represented by formula (B).;
申请公布号 US2017075224(A1) 申请公布日期 2017.03.16
申请号 US201615259160 申请日期 2016.09.08
申请人 JSR CORPORATION 发明人 Nakagawa Hisashi;Naruoka Takehiko;Nagai Tomoki
分类号 G03F7/20;G03F7/004;G03F7/11;G03F7/32;C08F220/38;C08F220/18;G03F7/16;G03F7/038;C08F220/28 主分类号 G03F7/20
代理机构 代理人
主权项
地址 Tokyo JP