| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces heat stress occurring in a semiconductor chip and a solder joining part of the semiconductor chip while ensuring heat radiation performance of the semiconductor chip.SOLUTION: A semiconductor device includes: a metal base member for heat radiation 1; a circuit pattern disposed on the metal base member 1; a semiconductor chip 6 which is joined onto the circuit pattern through a solder joining part; and a frame type member 9 which encloses the semiconductor chip 6 or a projection surface of the semiconductor chip 6 to the metal base member 1 and has a linear expansion coefficient smaller than that of the metal base member 1. |
