| 摘要 |
There are provided a package for mounting an electronic element which can be reduced in size and an electronic device. A package for mounting an electronic element includes an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad; and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. Consequently, the package for mounting an electronic element can be reduced in size, and is capable of suppressing electrical short-circuiting between the wiring conductor and an electronic element and of suppressing occurrence of a crack in the insulating base. |
