| 摘要 |
[Problem] To provide a semiconductor processing tape which has excellent pick-up properties and in which the thermal shrinkage rate in a tape shrinkage process is low, wrinkles do not occur, and kerf width extends sufficiently without displacement of chip position. [Solution] Provided is a semiconductor processing tape that is characterized by having an adhesive tape that is provided with a substrate film and an adhesive layer formed on at least one surface side of the substrate film, wherein in a process for fragmenting an adhesive by expansion, the relationship between the stress on only the substrate and the stress on the adhesive tape when the adhesive tape is subjected to a tensile elongation of 10% according to a method set forth in JIS7162 is: stress on adhesive tape/stress on only substrate = 1 or less. |
