| 摘要 |
PROBLEM TO BE SOLVED: To obtain a cooling structure of an electronic component which obtains the required heat radiation ability in cooling performed by using outer air and prevents deterioration of electronic components.SOLUTION: An electronic component 30 is housed in a housing 10, in which an intake port for suctioning out air and an exhaust port for exhausting the exhaust air into the outer air are formed, with devices. In a cooling structure of the electronic component 30, side plates of a control box 20, which face the interior of the housing 10, are formed by two plates, i.e, an inner side plate 25 and an outer side plate 26. Further, a hole 21 is formed at the inner side plate 25. The electronic component 30 is fixed to the inner side plate 25 so that a heat radiation surface of the electronic component 30 penetrates through the hole 21 to be pressed against an inner surface of the outer side plate 26. |
