| 摘要 |
Provided is an adhesive tape. In semiconductor transfer operation between adhesive tapes in a semiconductor manufacturing process, an adhesive tape can be used in order to smoothly perform the transfer operation without the use of high-cost and complex mechanical equipment such as mechanical arms or the like. The adhesive tape comprises an adhesive layer on a surface of a plastic film, wherein the adhesive force of the adhesive tape pasted on a SUS430BA board after 30 minutes in an environment with temperature of 23 degrees centigrade and humidity of 50% is set as P1, the adhesive force of the adhesive tape after placed 30 minutes in an environment with temperature of 23 degrees centigrade and humidity of 50% after the adhesive tape is placed pasted on a SUS430BA board after 10 minutes in an environment with temperature of 23 degrees centigrade and humidity of 50% is set as P2, the P2/P1 is over 1.2. |
