| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of joining an electronic component which can suitably join an electronic component to a substrate even when a pressure applied on the electronic component is reduced in joining the electronic component to the substrate.SOLUTION: A preliminarily dried film is formed on a substrate 10 by applying silver paste containing silver particles on the substrate 10. A surface of the preliminarily dried film is flattened by preliminarily pressurizing the preliminarily dried film, and an electronic component 14 such as an Si device is arranged on the flattened surface of the preliminarily dried film. Then, the electronic component 14 is joined to the substrate 10 through a silver junction layer 12 by heating and applying a pressure on the electronic component 14. |
