| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same capable of reducing a step in a boundary region between a memory cell array region and a peripheral circuit region.SOLUTION: A semiconductor device includes a substrate and a stack layer. The substrate includes a first region, a second region, and a third region. The third region is arranged between the first region and the second region. An upper surface of the substrate in the first region is lower than that in the second region. The substrate in the third region has a first step. The stack layer is arranged on the substrate in the first region and the third region. An upper surface of the stack layer in the first region and that of the substrate in the second region are substantially on the same plane.SELECTED DRAWING: Figure 2E |
