Apparatus and method for electrostatic spraying or electrostatic coating of a thin film

摘要

Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

主权项

1. A conductive film forming method for forming a conductive film for electromagnetic shielding on a semiconductor package in which a resin covers a semiconductor chip by electrostatic spraying or electrostatic coating, comprising:
preparing a liquid agent as ingredients of the conductive film, the liquid agent including at least one of nickel, copper and silver; applying a DC voltage or a pulse voltage to a nozzle; spraying or applying particles of the liquid agent from the nozzle toward or to the resin covering the semiconductor chip of the semiconductor package; moving the nozzle relative to the semiconductor package in X, Y and Z directions while maintaining a distance between a distal tip portion of the nozzle and a surface of the resin of the semiconductor package at about 0.5 to 20 mm; and forming the conductive film on the semiconductor package using the particles of the liquid agent.