| 发明名称 |
CUTTING BLADE |
| 摘要 |
Disclosed herein is a cutting blade including diamond abrasive grains and boron compound grains. The average grain size of the diamond abrasive grains falls within the range of 5 μm to 50 μm. The average grain size of the boron compound grains is greater than 1/5 and less than or equal to 1/2 of the average grain size of the diamond abrasive grains. |
| 申请公布号 |
US2017057054(A1) |
申请公布日期 |
2017.03.02 |
| 申请号 |
US201615240586 |
申请日期 |
2016.08.18 |
| 申请人 |
DISCO CORPORATION |
发明人 |
Maji Ryogo;Oshima Ryuji;Ishiai Yoshiki |
| 分类号 |
B24D5/12 |
主分类号 |
B24D5/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cutting blade including diamond abrasive grains and boron compound grains, wherein:
the average grain size of said diamond abrasive grains falls within the range of 5 μm to 50 μm; and the average grain size of said boron compound grains is greater than 1/5 and less than or equal to 1/2 of the average grain size of said diamond abrasive grains. |
| 地址 |
Tokyo JP |
