发明名称 MATCHING CIRCUIT AND HIGH-FREQUENCY AMPLIFIER
摘要 The present invention is configured in such a way that a bonding wire (19) connects one end of a main line (13) formed on a dielectric substrate (11) to one end of a main line (16) formed on a dielectric substrate (12), and a bonding wire (27) connects the other end of a branched line (21) formed on the dielectric substrate (12) to the other end of a branched line (23) formed on the dielectric substrate (11). This configuration can suppress impedance mismatching caused by a variation in distance between the dielectric substrate (11) and the dielectric substrate (12) due to an inconsistency in assembly occurring during manufacturing.
申请公布号 WO2017033334(A1) 申请公布日期 2017.03.02
申请号 WO2015JP74248 申请日期 2015.08.27
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 KAMIOKA, Jun;YAMANAKA, Koji;HANGAI, Masatake
分类号 H03H7/38 主分类号 H03H7/38
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