发明名称 |
MATCHING CIRCUIT AND HIGH-FREQUENCY AMPLIFIER |
摘要 |
The present invention is configured in such a way that a bonding wire (19) connects one end of a main line (13) formed on a dielectric substrate (11) to one end of a main line (16) formed on a dielectric substrate (12), and a bonding wire (27) connects the other end of a branched line (21) formed on the dielectric substrate (12) to the other end of a branched line (23) formed on the dielectric substrate (11). This configuration can suppress impedance mismatching caused by a variation in distance between the dielectric substrate (11) and the dielectric substrate (12) due to an inconsistency in assembly occurring during manufacturing. |
申请公布号 |
WO2017033334(A1) |
申请公布日期 |
2017.03.02 |
申请号 |
WO2015JP74248 |
申请日期 |
2015.08.27 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
KAMIOKA, Jun;YAMANAKA, Koji;HANGAI, Masatake |
分类号 |
H03H7/38 |
主分类号 |
H03H7/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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