发明名称 |
CMOS-MEMS INTEGRATION USING METAL SILICIDE FORMATION |
摘要 |
A method and system for forming a MEMS device are disclosed. In a first aspect, the method comprises providing a conductive material over at least a portion of a top metal layer of a base substrate, patterning the conductive material and the at least a portion of the top metal layer, and bonding the conductive material with a device layer of a MEMS substrate via metal silicide formation. In a second aspect, the MEMS device comprises a MEMS substrate, wherein the MEMS substrate includes a handle layer, a device layer, and an insulating layer in between. The MEMS device further comprises a base substrate, wherein the base substrate includes a top metal layer and a conductive material over at least a portion of the top metal layer, wherein the conductive material is bonded with the device layer via metal silicide formation. |
申请公布号 |
US2017057813(A1) |
申请公布日期 |
2017.03.02 |
申请号 |
US201514838237 |
申请日期 |
2015.08.27 |
申请人 |
InvenSense, Inc. |
发明人 |
SHIN Jong Il;SMEYS Peter;SHIN Jongwoo |
分类号 |
B81C1/00;B81B7/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming a MEMS device, wherein the MEMS device includes a MEMS substrate and a base substrate, wherein the base substrate includes a top metal layer and the MEMS substrate includes a handle layer, a device layer, and an insulating layer in between, the method comprising:
providing a conductive material over at least a portion of the top metal layer; patterning the conductive material and the at least a portion of the top metal layer; and bonding the conductive material with the device layer via metal silicide formation. |
地址 |
San Jose CA US |