CONVEYANCE APPARATUS FOR ELECTRONIC COMPONENTS AND APPARATUS FOR INDUSTRIAL USE EQUIPPED WITH THE CONVEYANCE APPARATUS

摘要

A depth of a cavity formed in a storing member is set to a depth which allows a portion of an electronic component to project from the cavity in a state where the electronic component is stored in the cavity. A storing member includes guide portions each of which is a space communicating with the cavity and configured to guide the electronic component into the cavity. A guide portion is formed such that a guide opening portion which is an opening portion of the guide portion is larger than an opening portion of the cavity and the opening portion of the cavity falls within a region of the guide opening portion as viewed in a depth direction of the cavity. A space formed of the cavity and the guide portion is configured to store an entire electronic component in the inside thereof.

主权项

1. A conveyance apparatus for electronic components comprising:
a storing member having a plurality of cavities in which an electronic component is stored respectively, an electronic component supply mechanism configured to supply a plurality of electronic components to be stored in the cavities to the storing member; and a moving unit configured to move the storing member in a predetermined direction in a relative relationship with the electronic component supply mechanism, the electronic components being sequentially stored in the plurality of cavities by moving the storing member and the electronic component supply mechanism relative to each other such that the plurality of respective cavities opposedly face the electronic components sequentially supplied from the electronic component supply mechanism, a depth of the cavity being set to a depth which allows a portion of the electronic component to project from the cavity in a state where the electronic component is stored in the cavity in a predetermined posture, the storing member including guide portions each of which is a space communicating with the cavity and configured to guide the electronic component into the cavity, the guide portion being formed such that a guide opening portion which is an opening portion of the guide portion is larger than an opening portion of the cavity and the opening portion of the cavity falls within a region of the guide opening portion as viewed in a depth direction of the cavity, and a storing space formed of the cavity and the guide portion being configured to store an entire electronic component in the inside thereof.