CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

摘要

Provided is a conductive material capable of improving conduction reliability by selectively disposing solder in conductive particles on an electrode. This conductive material includes, in an outer surface section of a conductive part, a plurality of conductive particles having solder, and a thermosetting component, and when difference scanning calorimetry is performed by heating the conductive particles and the thermosetting component at a temperature increase rate of 25-10°C/min, a temperature region indicating an endothermic peak derived from melting of the solder in the conductive particles and a temperature region indicating a exothermic peak derived from curing of the thermosetting component at least partially overlap each other.