METHOD FOR MANUFACTURING SEMICONDUCTOR LASER DEVICE INCLUDING WAVELENGTH CONVERTING MEMBER AND LIGHT TRANSMISSIVE MEMBER

摘要

The light emitting device according to the present invention comprises a laser diode; a wavelength converting member which is configured to convert a wavelength of a light emitted from the laser diode; and a support member which is configured to support the wavelength converting member so that the light passes through two surfaces of the wavelength converting member. The wavelength converting member comprises a fluorescent material and a binder. At least one light transmissive member is disposed on at least one of these two surfaces of the wavelength converting member. The binder has a melting point higher than a melting point of the light transmissive member. The light transmissive member is fixed to the support member by fusion bonding.

主权项

1. A method for manufacturing a semiconductor laser device, the method comprising:
providing a laser diode; providing a support member that has a through hole; disposing a wavelength converting member in the through-hole, wherein the wavelength converting member is configured to convert a wavelength of light emitted from the laser diode, wherein the wavelength converting member comprises a fluorescent material and a binder, and wherein the wavelength converting member is configured such that light enters the wavelength converting member via a first surface of the wavelength converting member, and exits the wavelength converting member via a second surface of the wavelength converting member; disposing a light transmissive member on the second surface of the wavelength converting member, wherein the light transmissive member comprises a fluorescent material and has a melting point lower than a melting point of the binder; fixing the light transmissive member to an inner wall of the through-hole of the support member and the second surface of the wavelength converting member by fusion bonding.