发明名称 EMI SHIELD TO SUPPRESS EMI LEAKAGE FROM ONE OR MORE OPTICAL PORTS OF AN OPTICAL COMMUNICATIONS MODULE
摘要 In one exemplary embodiment, an optical communications module includes an upper housing portion mated to a lower housing portion with an optical port projecting through an opening in a front surface of the mated assembly. Electronic circuit housed inside the mated assembly can lead to electromagnetic interference (EMI) leakage through a front surface of the mated assembly, especially through the opening that accommodates the optical port. An EMI shield, which is used to address the EMI leakage, includes an annular array of resilient metal fingers that press against a metal flange of the optical port, and also includes at least two peripheral edges each incorporating an array of resilient metal fingers that press against a metal portion of the mated assembly. An interdigital spacing in the annular array and/or the array of resilient metal fingers is defined on the basis of a wavelength associated with the EMI radiation.
申请公布号 US2017059798(A1) 申请公布日期 2017.03.02
申请号 US201514839107 申请日期 2015.08.28
申请人 Avago Technologies General IP (Singapore) Pte. Ltd. 发明人 Ritter Robert;Yashar Frank;Seetharam Venkatesh;Priyadarshi Sunil
分类号 G02B6/42;H05K9/00;H05K5/04 主分类号 G02B6/42
代理机构 代理人
主权项 1. An optical communications module comprising: an enclosure containing an electronic circuit assembly; and an electromagnetic interference (EMI) shield mounted inside the enclosure, the EMI shield comprising a first opening configured to accommodate a first optical port inserted therethrough, the first opening characterized by a first annular array of resilient metal fingers arranged to press against a metal portion of the first optical port for suppressing EMI emissions leaking from around a periphery of the first optical port, the EMI shield further including at least a first peripheral edge incorporating a linear array of resilient metal fingers arranged to press against a metal portion inside the enclosure.
地址 Singapore SG