摘要 |
Embodiments are described for integrating full-coaxial signal pins in an integrated circuit (IC) test socket. The socket can be made of a conductive metal (e.g., aluminum), and can be drilled with a large number of holes for conductive pins to interface between a printed circuit board (on which the socket is mounted) and an IC being tested. The pins can include ground pins, low-speed signal (and/or power) pins, and coaxial pin assemblies for high-speed signals (HSS). Each coaxial pin assembly can include a conductive HSS pin, having a HSS probe disposed in a spring-loaded HSS barrel, and an insulative bushing. The HSS pin is surrounded by the insulative bushing, which is disposed in a hole of the conductive socket body, thereby forming a full coaxial pin with controlled impedance characteristics. |