| 摘要 |
The invention relates to a device (100) having a first component (1), a second component (2), a connecting component (3) which is provided directly between the first component (1) and the second component (2), the connecting element (3) having at least a first metal (Me1) which: is in the form of an adhesion layer (4) provided directly on the first component (1) and/or the second component (2); is in the form of a diffusion barrier (5); is part of a first phase (31) and/or a second phase (32) of the connecting element (3), wherein the first and/or the second phase (31, 32) comprises, in addition to the first metal (Me1), also other metals that are different from the first metal, wherein the concentration (c11) of the first metal (Me1) in the first phase (31) is larger than the concentration (c25) of the first metal (Me1) in the second phase (32). |
