发明名称 ダイシングシート
摘要 PROBLEM TO BE SOLVED: To provide a dicing sheet which is excellent in adhesiveness, hardly causes a pickup failure, and suppresses falling-off of a chip.SOLUTION: The dicing sheet includes a substrate 2 and an adhesive layer 3 laminated on at least one surface of the substrate 2. The adhesive layer 3 is formed of an adhesive composition containing a polymer (A), an energy ray-polymerizable compound (B), and a tackifying resin (C). The energy ray-polymerizable compound (B) has an energy ray-polymerizable group in an amount of 3×10to 5×10mol/g inclusive. The tackifying resin (C) contains a hydrogenated resin. Preferably, the tackifying resin (C) consists of the hydrogenated resin.
申请公布号 JP6087122(B2) 申请公布日期 2017.03.01
申请号 JP20120264954 申请日期 2012.12.04
申请人 リンテック株式会社 发明人 西田 卓生;金井 道生
分类号 H01L21/301;C09J4/06;C09J7/02;C09J133/00;C09J201/00 主分类号 H01L21/301
代理机构 代理人
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