| 摘要 |
PROBLEM TO BE SOLVED: To provide a film with an ultrathin copper layer, the film including the ultrathin copper layer on which a void does not exist substantially, the ultrathin copper layer haing excellent fine wiring formability.SOLUTION: The film with the ultrathin copper layer includes a carrier copper foil sheet and the ultrathin copper layer. The carrier copper foil sheet has a copper foil base material and a coating layer with which the surface of the copper foil base material is coated and which comprises a material containing a metal other than copper. The ultrathin copper layer is bonded to the coating layer of the carrier copper foil sheet. The bonded surface of the coating layer to the ultrathin copper layer has 150 nm or lower arithmetic average roughness (Ra). The ultrathin copper layer is deposited by an electron beam vapor deposition method and has 50-5,000 nm thickness. |
