| 摘要 |
The method involves irradiating line of light for performing scanning process of soldering seam (2) of test object (1), by a directional laser light source (14). The reflected light from the soldering seam lying transverse to course direction (33) is received using optical sensor (12), and evaluated as linear image. Two-dimensional checking process of the soldering seam is performed by illuminating the diffuse light in the region of the previously irradiated line of light such that the reflected light is again received using optical sensor, and the image is evaluated. An independent claim is included for device for performing non-contact optical inspection of soldering seam or sticking seam in test object. |
