| 摘要 |
The present invention discloses an electronic component package structure and an electronic device. The electronic component package structure includes at least: a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 mm. With the present invention, planar capacitance intensity of a planar capacitance structure formed by the conductive lid, the non-conductive adhesive, and the substrate is increased, and further, planar capacitance of the planar capacitance structure formed by the conductive lid, the non-conductive adhesive, and the substrate can be increased. Therefore, EMI radiated can be reduced effectively, and an EMI shielding effect of the shielding space can be improved. |
