| 摘要 |
PROBLEM TO BE SOLVED: To provide a flux composition which suppresses generation of missing bump and in which there is few remaining scraper of the solder composition during printing when the flux composition is formed into the solder composition, the solder composition, and an electronic substrate on which an electronic component is mounted by using the solder composition.SOLUTION: The flux composition includes rosin resin, solvent, an organic acid, and a thixotropic agent. The solvent is made by mixing polyalkylene glycol monoalkyl ether and polyalkylene glycol dialkyl ether. The particle diameter of the thixotropic agent in the composition is 10 μm or less in measurement by fineness of grind gage. |
