发明名称 |
Automatic generation of reference spectra for optical monitoring of substrates |
摘要 |
A computer-implemented method of generating reference spectra includes polishing a first substrate in a polishing apparatus having a rotatable platen, measuring a sequence of spectra from the substrate during polishing with an in-situ monitoring system, associating each spectrum in the sequence of spectra with a index value equal to a number of platen rotations at which the each spectrum was measured, and storing the sequence of spectra as reference spectra. |
申请公布号 |
US9579767(B2) |
申请公布日期 |
2017.02.28 |
申请号 |
US201113087789 |
申请日期 |
2011.04.15 |
申请人 |
Applied Materials, Inc. |
发明人 |
Qian Jun;Lee Harry Q. |
分类号 |
B24B49/12;B24B37/013;B24B37/04;B24B37/10;B24B37/20;B24B49/04 |
主分类号 |
B24B49/12 |
代理机构 |
Fish & Richardson P.C. |
代理人 |
Fish & Richardson P.C. |
主权项 |
1. A computer-implemented method of generating reference spectra, comprising:
polishing a first substrate in a polishing apparatus having a rotatable platen; measuring a first sequence of spectra from the first substrate during polishing with a first in-situ monitoring system; associating each spectrum in the first sequence of spectra with an index value equal to a number of platen rotations at which the each spectrum was measured; storing the first sequence of spectra as reference spectra; receiving data from a second in-situ monitoring system that monitors the first substrate during polishing of the first substrate; detecting a polishing endpoint of the first substrate during polishing of the first substrate based on the data from the second in-situ monitoring system and without accessing data from the first in-situ monitoring system to detect the polishing endpoint; determining a target index value based on the number of platen rotations at the time the polishing endpoint is detected by the second in-situ monitoring system; polishing a second substrate in the polishing apparatus; measuring a second sequence of spectra from the second substrate during polishing with the first in-situ monitoring system and without the second in-situ monitoring system; and adjusting a polishing parameter for at least one zone on the second substrate to adjust a polishing rate of the at least one zone based on the reference spectra, the second sequence of spectra, and the target index value. |
地址 |
Santa Clara CA US |