Thermal management in electronic devices with yielding substrates

摘要

In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.

主权项

1. An electronic device comprising:
a substrate having first and second conductive traces on a first surface thereof, the first and second conductive traces being separated on the substrate by a gap therebetween; a light-emitting diode (LED) having first and second distinct electrical contacts on a first LED surface thereof, the first and second contacts being attached and electrically coupled to, respectively, the first and second conductive traces; a thermal pad; and a substrate thermal pad, wherein (i) the substrate thermal pad is disposed on the first surface of the substrate, (ii) at least a portion of the thermal pad is disposed between the first and second electrical contacts, (iii) at least a portion of the thermal pad is disposed between the substrate thermal pad and the LED, (iii) the substrate thermal pad is electrically isolated from at least one of the first or second conductive traces, (iv) the thermal pad thermally couples the LED to the substrate thermal pad without electrically coupling the LED to the substrate, (v) the thermal pad has a thermal conductivity greater than 1 W/(m·K), and (vi) the substrate thermal pad comprises one or more electrically conductive materials.