Electronic component metal material and method for manufacturing the same

摘要

There are provided an electronic component metal material which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The electronic component metal material 10 includes a base material 11 , an A layer 14 constituting an outermost surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer) 14 has a thickness of 0.002 to 0.2 μm, and the middle layer (B layer) 13 has a thickness larger than 0.3 μm.

主权项

1. An electronic component metal material having low whisker formability and high durability, comprising:
a base material; an A layer constituting an outermost surface layer on the base material and being formed of Sn, In or an alloy thereof; a B layer constituting a middle layer provided between the base material and the A layer and being formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, and satisfying the following (a) or (b): (a) wherein the outermost surface layer (A layer) has a thickness of 0.002 to 0.2 μm; and the middle layer (B layer) has a thickness larger than 0.3 μm, (b) wherein the outermost surface layer (A layer) has a deposition amount of Sn, In of 1 to 150 μg/cm2; and the middle layer (B layer) has a deposition amount of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir of larger than 330 μg/cm2, and (c) wherein the outermost surface layer (A layer) has a surface arithmetic average height (RA) of 0.1 μm or lower.