System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille

摘要

A packaged MEMS device may include an embedding arrangement, a MEMS device disposed in the embedding arrangement, a sound port disposed in the embedding arrangement and acoustically coupled to the MEMS device, and a grille within the sound port. Some embodiments relate to a sound transducer component including an embedding material and a substrate-stripped MEMS die embedded into the embedding material. The MEMS die may include a diaphragm for sound transduction. The sound transducer component may further include a sound port within the embedding material in fluidic or acoustic contact with the diaphragm. Further embodiments relate to a method for packaging a MEMS device or to a method for manufacturing a sound transducer component.

主权项

1. A packaged MEMS device comprising:
an embedding arrangement comprising a mold compound; a MEMS device embedded in the mold compound of the embedding arrangement, wherein the MEMS device comprises a diaphragm for sound transduction, and wherein the mold compound braces the diaphragm; a sound port embedded in the mold compound of the embedding arrangement, the sound port acoustically coupled to the MEMS device; and a grille disposed in the sound port.