Optoelectronic semiconductor component and method for producing said component

摘要

An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.

主权项

1. An optoelectronic semiconductor component comprising:
a carrier comprising at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places; electrical contact structures fitted at least indirectly to the carrier; a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the plurality of optoelectronic semiconductor chips configured to generate radiation; and a filling fitted around the semiconductor chips, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, wherein the filling terminates flush with the semiconductor chips, in a direction away from the conversion-medium body, wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structures, wherein the electrical contact structures comprise conductor tracks, wherein the conductor tracks are designed for energizing the semiconductor chips, and wherein the conductor tracks are situated in a plane between the carrier and the semiconductor chips.