发明名称 Method and system for power connector removal
摘要 A system for removing a plurality of connectors from a circuit board includes two clamp plates. The system includes a divider plate coupled between the two clamp plates. The divider plate is configured to be positioned between adjacent rows of the plurality of connectors. The system further includes a tightening mechanism to tighten the clamp plates and the plurality of pin plates around the plurality of connectors. The system also includes an ejector coupled to the divider plate. The ejector includes a slot that corresponds to a projection on the divider plate, and the divider plate is configured to slide relative to the ejector.
申请公布号 US9583906(B2) 申请公布日期 2017.02.28
申请号 US201313886837 申请日期 2013.05.03
申请人 Fujitsu Limited 发明人 Cloer Jimmy Kevin
分类号 B23P19/00;H01R43/20 主分类号 B23P19/00
代理机构 Baker Botts L.L.P. 代理人 Baker Botts L.L.P.
主权项 1. A system for removing a plurality of connectors from a circuit board, comprising: a first clamp plate and a second clamp plate arranged in parallel with respect to each other; a divider plate arranged in parallel with the first clamp plate and the second clamp plate and coupled between the first clamp plate and the second clamp plate, the divider plate including a projection extending in a direction perpendicular to the parallel arrangement of the first clamp plate, the second clamp plate, and the divider plate, wherein the divider plate is configured to be positioned between adjacent rows of the plurality of connectors and the divider plate comprises one or more grooves configured to grip one or more of the plurality of connectors; a tightening mechanism to tighten the first clamp plate, the second clamp plate, and the divider plate around the plurality of connectors; and an ejector coupled to the divider plate via the projection on the divider plate and a slot located on a surface of the ejector that extends in a direction parallel to the divider plate, the divider plate configured to slide relative to the ejector.
地址 Kawasaki JP