Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member

摘要

The present invention provides a method for producing an electronic component, capable of simply and efficiently producing an electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method is a method for producing an electronic component. The electronic component includes: a substrate 21, a chip(s) 31, a resin 41, a plate-like member 11 having a surface(s), a bump(s) 12 that includes a deformable portion 12A, and a wiring pattern 22. The method includes: disposing the chip(s) 31 on the surface(s); and encapsulating the bump(s) 31 in the resin 41. The encapsulating includes: encapsulating the chip(s) 31 in the resin 41 between a bump 12-formed surface of the plate-like member 11 on which the bump(s) 12 is formed and a wiring pattern 22-formed surface of the substrate 21 on which the wiring pattern is formed; and causing the bump(s) 12 to be in contact with the wiring pattern 22.

主权项

1. A method for producing an electronic component comprising: a substrate having a surface, at least one chip, a resin, a plate-like member having at least one surface, at least one bump that is in a plate shape and includes a deformable portion formed by being folded once or multiple times, and a wiring pattern wherein the plate-like member, the bump and the deformable portion are conductive, the method comprising:
disposing the one chip on the surface of the substrate, and encapsulating the at least one chip in the resin; wherein the encapsulating comprises:
encapsulating the one chip in the resin between a bump-formed surface of the plate-like member on which the one bump is formed and a wiring pattern-formed surface of the substrate on which the wiring pattern is formed such that the deformable portion is located between the bump-formed surface and the wiring pattern-formed surface in a shrunk fashion sandwiched between the bump-formed surface and the wiring pattern-formed surface; andcausing the at least one bump to be in contact with the wiring pattern.