Substrate, chip arrangement, and method for manufacturing the same

摘要

In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.

主权项

1. A chip arrangement comprising:
a first substrate, comprising:
a ceramic carrier comprising a first side and a second side opposite the first side;a first metal layer disposed over the first side of the ceramic carrier;a second metal layer disposed over the second side of the ceramic carrier;a cooling structure formed into or over the second metal layer; wherein the cooling structure is formed from the same metal as the second metal layer;wherein the cooling structure is configured to form a structure selected from a group consisting of a pin structure, a fin structure, and combinations thereof; a chip disposed on the first metal layer of the first side of the first substrate, wherein the chip is electrically coupled to the first metal layer of the first substrate; and a second substrate, comprising:
a ceramic carrier comprising a first side and a second side opposite the first side;a first metal layer disposed over the first side of the ceramic carrier;a second metal layer disposed over the second side of the ceramic carrier; anda cooling structure formed into or over the second metal layer; wherein the cooling structure is formed from the same metal as the second metal layer; wherein the chip is sandwiched between the first substrate and the second substrate and furthermore directly coupled to the second substrate, wherein the chip is furthermore electrically coupled to the first metal layer of the second substrate.