Conductive pillar shaped for solder confinement

摘要

Pillar-type connections and methods for fabricating a pillar-type connection. A conductive layer is formed on a bond pad. A second conductive layer is formed on the first conductive layer to define a conductive pillar. The conductive pillar includes a non-planar top surface defining a recess. The recess may receive a portion of a solder body used to connect the conductive pillar with a package.

主权项

1. A method of fabricating a pillar-type connection, the method comprising:
forming a bond pad; forming, on the bond pad, a first conductive layer including a hollow core; and forming a second conductive layer on the first conductive layer to define a conductive pillar,wherein the conductive pillar includes a non-planar top surface defining a recess aligned with the hollow core.