METHOD, APPARATUS, AND SYSTEM FOR PASSIVE DIE STRAIN MEASUREMENT

摘要

At least one method, apparatus, and system for determining a distance between layers of a semiconductor device and, if desired, modifying a semiconductor device manufacturing process in view of the determined distance. The system comprises and the methods make use of a test circuit comprising a resistor, at least one of an inductor and a capacitor, a first terminal and a second terminal each configured to electrically connect to a first layer circuit and a second layer circuit of a semiconductor device.

主权项

1. A method, comprising:
providing an input voltage (Vin) to a resistor of a test circuit, wherein the test circuit comprises the resistor in series with an impedance unit, and the test circuit comprises a first terminal in contact with a first layer circuit of a semiconductor device and a second terminal in contact with a second layer circuit of the semiconductor device; receiving an output voltage (Vout) from the test circuit; and determining at least one of a distance between the first layer and the second layer or a stress in at least one of the first layer and the second layer, based on Vout and Vin.