| 发明名称 |
ELECTRONIC DEVICE HAVING A REDISTRIBUTION AREA |
| 摘要 |
An electronic device includes an upper insulating layer on a substrate. An upper redistribution structure is embedded in the upper insulating layer. The upper redistribution structure includes an upper contact portion, an upper pad portion, and an upper line portion between the upper contact portion and the upper pad portion. A passivation layer is on the upper insulating layer and the upper redistribution structure. An upper opening is configured to pass through the passivation layer and expose the upper pad portion. Vertical thicknesses of the upper pad portion and the upper contact portion are greater than a vertical thickness of the upper line portion. |
| 申请公布号 |
US2017053882(A1) |
申请公布日期 |
2017.02.23 |
| 申请号 |
US201615209298 |
申请日期 |
2016.07.13 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Jin Jeonggi;Lee Kyu-Ha;Chun Jinho;Park Byunglyul;An Jinho |
| 分类号 |
H01L23/00;H01L25/00;H01L21/78;H01L23/31;H01L25/11 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
an upper insulating layer on a substrate; an upper redistribution structure embedded in the upper insulating layer, wherein the upper redistribution structure comprises an upper contact portion, an upper pad portion, and an upper line portion between the upper contact portion and the upper pad portion; a passivation layer on the upper insulating layer and the upper redistribution structure; and an upper opening configured to pass through the passivation layer and expose the upper pad portion, wherein vertical thicknesses of the upper pad portion and the upper contact portion are greater than a vertical thickness of the upper line portion. |
| 地址 |
Suwon-si KR |
