| 发明名称 |
PRINTED WIRING BOARD AND MAGNETICSHIELD PACKAGE |
| 摘要 |
According to one embodiment, a printed wiring board includes a first magnetic layer, a second magnetic layer, an insulating layer, a first conductor layer, and a second conductor layer. The insulating layer is provided between the first magnetic layer and the second magnetic layer. The first conductor layer is provided between the insulating layer and the first magnetic layer. The second conductor layer is provided between the insulating layer and the second magnetic layer. |
| 申请公布号 |
US2017050842(A1) |
申请公布日期 |
2017.02.23 |
| 申请号 |
US201615242373 |
申请日期 |
2016.08.19 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
YAMADA Keiju;SHIMOKAWA Kazuo;IGUCHI Tomohiro;HARA Michiko;SHIBANO Motomichi |
| 分类号 |
B81B7/00;H01L23/522;H01L23/552;H01L23/498 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed wiring board comprising:
a first magnetic layer; a second magnetic layer; an insulating layer provided between the first magnetic layer and the second magnetic layer; a first conductor layer provided between the insulating layer and the first magnetic layer; and a second conductor layer provided between the insulating layer and the second magnetic layer. |
| 地址 |
Tokyo JP |
