PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.

主权项

1. A package structure comprising:
a circuit substrate comprising:
at least one core layer having a disposition area, a bent area surrounding the disposition area, and an upper surface and a lower surface opposite to each other;a build-up structure arranged on the core layer and located in the disposition area, the build-up structure comprising at least three patterned circuit layers, at least two dielectric layers and a plurality of conductive through holes, wherein the patterned circuit layers and the dielectric layers are alternately stacked, and the conductive through holes are electrically connected to every two adjacent patterned circuit layers; anda plurality of circuit pads arranged on the lower surface of the core layer and located in the bent area; at least one electronic component embedded in at least one of the dielectric layers and located in the disposition area, wherein the electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes; and a connecting slot having a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions, wherein the circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through the bent area of the core layer bent relative to the disposition area.