| 摘要 |
This invention enables Frequency Selective Surface (“FSS”) and Artificial Magnetic Conductor (“AMC”) which exhibits Electromagnetic Band Gap (“EBG”) in any of the substrate's layer from a small and thin systems and sub-systems in package to a large-format PCBs. The metamaterial substrate may be integrated with electronic circuit components or buried in PCBs for circuit designs capable of transmitting, receiving and reflecting electromagnetic energy, altering electromagnetic properties of natural circuit materials, enhancing electrical characteristics of electrical components (such as filters, antennas, baluns, power dividers, transmission lines, amplifiers, power regulators, and printed circuits elements) in systems and sub-systems circuit designs. The metamaterial substrate creates new electrical characteristics, properties and systems, sub-systems or component's specification not readily available with conventional circuit materials, substrates, and PCBs. The metamaterial substrate can be less than 70 μm thick and buried into any PCB layer. |
