| 摘要 |
Described is an electronic device, including a top frame, a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, a heat sink associated with the thermal pad and a plurality of springs for providing a biasing force that retains the heat sink against the thermal pad, the heat sink including a planar portion surrounding a central depression, wherein the plurality of springs secure the thermal pad of the circuit board between the central depression portion of the heat sink and the circuit board. |
