发明名称 固定部材及び加工方法
摘要 PROBLEM TO BE SOLVED: To provide a fixing member which fixes a wafer to be processed, and can be easily removed from the processed wafer.SOLUTION: A fixing member has the same thickness as that of a wafer (W), and is formed into an annular shape having an inner diameter (di2) equal to an outer diameter (dw) of the wafer and an outer diameter (do2) larger than the outer diameter of the wafer, and comprises: an annular shape body (12) having an inner peripheral surface (12c) corresponding to an upper surface side of a chamfer portion (Wc) provided in an outer peripheral edge portion of the wafer; and a disk-shaped rigid plate (11) having an outer diameter (d1) equal to or larger than an outer diameter of the annular shape body. A contact portion (112) having the same shape as that of the annular shape body is provided on a side of an upper surface (11a) of the rigid plate. One of a bottom surface (12b) of the annular shape body and the contact portion of the rigid plate is composed of a material having a magnetic property, and the other thereof is composed of a material to be attracted by magnetic force. The inner peripheral surface of the annular shape body is abutted on the chamfer portion, and the bottom surface of the annular shape body and the chamfer portion of the rigid plate are attracted to each other by magnetic force to hold the wafer.
申请公布号 JP6084073(B2) 申请公布日期 2017.02.22
申请号 JP20130040660 申请日期 2013.03.01
申请人 株式会社ディスコ 发明人 坂本 吉行;坂井 真樹
分类号 H01L21/304;H01L21/683 主分类号 H01L21/304
代理机构 代理人
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