发明名称 導電性粒子、導電材料及び接続構造体
摘要 PROBLEM TO BE SOLVED: To provide a conductive particle that is used to connect between electrodes so as to lower connection resistance between the electrodes, and furthermore improve conduction reliability between the electrodes, and conductive material using the conductive particle.SOLUTION: A conductive particle 1 according to the invention includes a base particle 2, and a conductive layer 3 placed on a surface of the base particle 2. The conductive layer includes a crystal structure, is in contact with the base particle 2, and includes nickel and phosphorus. Conductive material according to the invention includes the above-mentioned conductive particle 1 and binder resin.
申请公布号 JP6084868(B2) 申请公布日期 2017.02.22
申请号 JP20130046815 申请日期 2013.03.08
申请人 積水化学工業株式会社 发明人 西岡 敬三
分类号 H01B5/00;C08J7/00;C09C3/06;C09J9/02;C09J201/00;C23C18/36;H01B1/00;H01B1/22;H01R11/01 主分类号 H01B5/00
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