Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination

摘要

The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.

主权项

1. A system for performing planarization treatment of a pressure-sensitive adhesive (PSA), comprising:
a planarization tool, the planarization tool including:
a support portion, the support portion including a support surface;a plurality of brackets extending upward from the support surface; anda carriage having a plurality of apertures formed therethrough such that when the carriage is positioned on the plurality of brackets, the plurality of brackets extend through the plurality of apertures and the carriage is spaced apart from the support surface, and the carriage and the plurality of brackets collectively define a plurality of holders, each holder configured to receive a PSA block including the PSA, the support portion and the carriage further configured for forming a partial enclosure when the carriage is placed upon the plurality of brackets;a pressurization tool configured with a partial enclosure, the partial enclosure of the pressurization tool having a port configured for connection to a pressurizing source;a flexible membrane configured for being positioned between the planarization tool and the pressurization tool, the flexible membrane being further configured for sealing the partial enclosure of the pressurization tool to create a first sealed cavity and for sealing the partial enclosure of the planarization tool to create a second sealed cavity when placed between the planarization tool and pressurization tool, the flexible membrane is further configured for applying a pressure created within the first sealed cavity to the PSA block when the first sealed cavity is pressurized,wherein the carriage of the planarization tool is configured for causing the flexible membrane to apply the pressure to the PSA block in a generally uniform, unidirectional and localized manner, the applied pressure promoting suitability of the PSA for use in rigid-to-rigid lamination processes.