3DIC packages with heat dissipation structures

摘要

A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion not overlapped by the first die. A first Thermal Interface Material (TIM) is over and contacting a top surface of the first die. A heat dissipating lid has a first bottom surface contacting the first TIM. A second TIM is over and contacting the second portion of the second die. A heat dissipating ring is over and contacting the second TIM.

主权项

1. A method comprising:
bonding a device die onto a package substrate; bonding a die stack onto the device die, wherein the die stack comprises a plurality of dies, and the device die comprises:
a first portion overlapped by the die stack; anda second portion extending laterally beyond an edge of the die stack; dispensing a first Thermal Interface Material (TIM) onto a top surface of the die stack; dispensing a second TIM onto the second portion of the device die; adhering a heat dissipating lid to the first TIM; and adhering a heat dissipating ring to the second TIM.