Pad structure design in fan-out package

摘要

A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of non-solder electrical connectors underlying and electrically coupled to the plurality of redistribution lines. The plurality of non-solder electrical connectors includes a corner electrical connector. The corner electrical connector is elongated. An electrical connector is farther away from the corner than the corner electrical connector, wherein the electrical connector is non-elongated.

主权项

1. A package comprising:
a bottom package comprising:
a corner;a first device die;a plurality of redistribution lines underlying the first device die;a plurality of non-solder electrical connectors underlying and electrically coupled to the plurality of redistribution lines, wherein the plurality of non-solder electrical connectors comprises:
a corner electrical connector, wherein the corner electrical connector is elongated; andan electrical connector farther away from the corner than the corner electrical connector, wherein the electrical connector is non-elongated; anda dielectric layer, with the plurality of non-solder electrical connectors in the dielectric layer; anda solder region forming an elongated interface with the corner electrical connector, wherein the elongated interface is coplanar with a bottom surface of the dielectric layer.