发明名称 High-throughput graphene printing and selective transfer using a localized laser heating technique
摘要 A method of high-throughput printing and selective transfer of graphene onto a substrate includes the steps of: providing a thermal release tape having graphene adhered thereto; placing a substrate onto the graphene; pressing the thermal tape and the graphene against the substrate at a uniformly-distributed pressure; heating localized portions of the thermal tape and graphene using a localized heat source, thereby diminishing the adhesive properties of the thermal release tape in the localized portions and transferring graphene from said localized portions to the substrate; and separating the thermal release tape from the substrate. The method may include the further step of moving the localized heat source to selected positions on the thermal release tape during the heating step, thereby forming a pattern of heated portions. The method may use a laser beam as the localized heat source, movement of the laser beam being performed by a computer-controlled deflectable mirror.
申请公布号 US9573814(B2) 申请公布日期 2017.02.21
申请号 US201414185350 申请日期 2014.02.20
申请人 The Trustees of the Stevens Institute of Technology 发明人 Patil Vikram;Kim Youn-Su;Kumar Kitu;Yang Eui-Hyeok
分类号 H01L21/02;C01B31/04;H01L29/66 主分类号 H01L21/02
代理机构 Greenberg Traurig, LLP 代理人 Greenberg Traurig, LLP
主权项 1. A method for selective transfer of graphene onto a substrate, comprising the steps of: providing a thermal release tape having graphene adhered thereto; placing a substrate against the graphene such that the graphene is positioned between the thermal release tape and the substrate; pressing the graphene against the substrate; heating a first localized portion of the thermal release tape using a localized heat source, thereby diminishing the adhesive properties of the thermal release tape at the first localized portion such that graphene from the localized portion is transferable to the substrate; and moving the localized heat source from the first localized portion of the thermal release tape to a second localized portion of the thermal release tape during said heating step, thereby forming a pattern of localized portions.
地址 Hoboken NJ US