发明名称 Power relaying apparatus, power transmission system and method for manufacturing power relaying apparatus
摘要 Disclosed herein is a power relaying apparatus provided between: a power supplying apparatus including a power supplying resonance device and a power supplying power supply section for supplying an AC current to the power supplying resonance device; and a power receiving apparatus having a power receiving resonance device for receiving a power from the power supplying apparatus by adoption of a resonance method, the power relaying apparatus including a power relaying resonance device resonating between the power supplying resonance device and the power receiving resonance device, wherein the power relaying resonance device is fixed at a predetermined position by making use of an insulation member.
申请公布号 US9577439(B2) 申请公布日期 2017.02.21
申请号 US201514724264 申请日期 2015.05.28
申请人 SONY CORPORATION 发明人 Uramoto Yoichi;Narikiyo Takashi
分类号 H01F27/42;H01F37/00;H01F38/00;H02J5/00 主分类号 H01F27/42
代理机构 Chip Law Group 代理人 Chip Law Group
主权项 1. A power relaying apparatus, comprising: a plurality of power relaying resonance devices disposed between a power supplying device and a power receiving device, wherein the plurality of power relaying resonance devices are configured to resonate between the power supplying device and the power receiving device; and a holding body configured from an insulation member configured to electrically insulate the plurality of power relaying resonance devices at resonance, wherein the plurality of power relaying resonance devices are enclosed inside the holding body, andwherein the plurality of power relaying resonance devices are disposed at respective determined positions within the holding body to relay power.
地址 Tokyo JP