PHOTONIC SINTERING OF A SOLDERABLE POLYMER THICK FILM COPPER CONDUCTOR COMPOSITION

摘要

This invention provides a polymer thick film copper conductor composition for forming a solderable and highly solder leach resistant electrical conductor and a method for using the polymer thick film copper conductor composition to form the electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.

主权项

1. A polymer thick film copper conductor composition comprising:
(a) 60 to 95 wt % copper powder possessing particles with an average particle size of 0.2 to 10 μm and a surface area/mass ratio in the range of 0.2 to 3.0 m2/g; dispersed in (b) 4 to 35 wt % organic medium comprising
(1) 2-7 wt % polyimide resin, dissolved in(2) an organic solvent; and (c) 0.0 to 1 wt % viscosity stabilizing agent comprising a carboxylic acid containing compound;in the absence of a reducing agent and wherein the ratio of the weight of the copper powder to the weight of the polyimide resin is at least 13 and wherein the wt % are based on the total weight of the polymer thick film copper conductor composition.