METHOD OF BONDING FLEXIBLE PRINTED CIRCUITS

摘要

A method for forming electrical connections between a first plurality of electrical conductors and a second plurality of electrical conductors, the method comprising: providing a first cushion (32) on a mount (26); disposing a first substrate (10) on the mount wherein a first side of the first substrate is in contact with the first cushion and a second side of the first substrate comprises the first plurality of electrical conductors (12); depositing an anisotropic conductive (AC) bonding material (18) on the first plurality of electrical conductors; aligning a second substrate 14 with the first substrate, wherein a first side of the second substrate comprises the second plurality of conductors (16), and wherein the second plurality of conductors are aligned with the first plurality of conductors such that the AC bonding material is sandwiched between the first side of the first substrate and the first side of the second substrate; providing a second cushion (28) on the second substrate; applying heat and pressure to the second cushion to form the AC bond between the first and second plurality of conductors; wherein the first and second cushions are formed of a thermally resistive and elastic material to enable substantially uniform pressure and heat to be applied across the first and second plurality of electrical conductors when forming the AC bond.

主权项

1. A method for forming electrical connections between a first plurality of electrical conductors and a second plurality of electrical conductors, the method comprising:
providing a first cushion on a mount; disposing a first substrate on the mount wherein a first side of the first substrate is in contact with the first cushion and a second side of the first substrate comprises the first plurality of electrical conductors; depositing an anisotropic conductive (AC) bonding material on the first plurality of electrical conductors; aligning a second substrate with the first substrate, wherein a first side of the second substrate comprises the second plurality of conductors, and wherein the second plurality of conductors are aligned with the first plurality of conductors such that the AC bonding material is sandwiched between the first side of the first substrate and the first side of the second substrate; providing a second cushion on the second substrate; applying heat and pressure to the second cushion to form the AC bond between the first and second plurality of conductors; wherein the first and second cushions are formed of a thermally resistive and elastic material to enable substantially uniform pressure and heat to be applied across the first and second plurality of electrical conductors when forming the AC bond.